To meet the increasingly compact component distribution requirements in advanced packaging technologies, EYANG Technology has launched ultra-thin MLCCs specifically designed for the internal embedding scenarios of chips.

In the typical PCB scenario on the front side of a chip, since most components, including the chip itself, still maintain a relatively high height, the height reduction of MLCC mainly needs to match the height of other components below. However, on the back side of the chip, if more filtering and decoupling capacitors are required, the height of MLCC needs to be lower than the height of the solder balls (as shown in Figure 1). In higher-end chips, the size of the solder balls is also continuously shrinking, and the requirements for the height of the back-mounted MLCC become increasingly strict. If using an ordinary packaged MLCC, the height cannot meet the requirement of being lower than the pins.

 Therefore, EYANG Technology has utilized its advanced ceramic powder dispersion technology and thin-layer dielectric technology, combined with the optimization of each process, to achieve a breakthrough in ultra-thin MLCC - launching ultra-thin specifications with L/W of 0201 and Tmax of 0.11mm, which are suitable for chip back-mounting scenarios. The back-mounting scenario can effectively shorten the current path and improve the efficiency of the chip. (The application diagram of ultra-thin MLCC is shown in the following figure)

Figure 1: Schematic Diagram of Thin MLCC Package Application

The length and width of the ultra-thin MLCC are the same as those of the conventional 0201 MLCC products. The main feature lies in the reduction of the overall thickness of the product, making the MLCC appear flatter (as shown in Figure 2). The thin dielectric technology it adopts is equivalent to the design level of the 0201-4.7μF product. Currently, EYANG Technology mainly introduces the ultra-thin 0201 size MLCC specifications of 100nF (for basic parameter information, please refer to Table 1).

Figure 2: Schematic diagram of the appearance of ultra-thin MLCC

This product can meet the demanding working conditions of the chip's periphery and internal components, and has a high level of reliability .

More thin-profile specifications and smaller-sized specifications are all featured on EYANG Technology's product roadmap. EYANG Technology will continue to develop miniaturized MLCC , respond to the differentiated demands of various clients, and contribute to the advancement of miniaturization and lightweighting technologies in end products.