With the fast growth of applications on AI, data center, 5G, IoT, automotive electronics, and wearables equipment, the demand for data storage chips has increased. Comparing with the traditional eMMC Storage, the Universal Flash Storage (UFS) has significant performance improvements with higher storage capacities and faster data transfer speeds. USF chips have been used in new smartphones, laptops, tablets, and other mobile devices.

To enhance signal transmission integrity and reliability around the chip, capacitors are needed for decoupling and energy storage. The embedded capacitor technology does not only save PCB space, but also reduces electromagnetic interference and noise, and improves circuit stability. No doubt, this trend also enhances the demand of Low-Profile capacitors.

EYANG has developed Low-Profile MLCC products, specifically the C0201X5R105M6R3NCZ (0201/X5R/1μF/±20%/6.3V). This product has the following key features:

The product has a maximum thickness of 0.22mm, which is 37% thinner than the regular size 0201 MLCC.

Despite the reduced thickness, the electrical performance parameters (capacitance, loss, insulation resistance) are comparable to regular products.

The general characteristics (temperature characteristics, DC bias characteristics) are also comparable to conventional products under the thinner thickness requirements.

UFS technology is rapidly advancing, with new versions like UFS 3.1 offering higher data transfer speeds and larger storage capacities. These advancements enable UFS to provide faster and more reliable storage solutions for various applications. Meanwhile, to adapt to the trend of increasingly thinner mobile devices like smartphones, chip packaging designs need to be correspondingly thinner, increasing the demand for thinner components.

Compared to traditional technology where all components are soldered to the PCB surface, the embedding technologies and components have the following advantages:

Since its establishment in 2001, EYANG Technology has been focused on the R&D and manufacturing of MLCCs. EYANG has been leading the domestic MLCC market in the research of ultra-fine dielectric ceramic powder, dielectric thin-layer technology, and product application characteristics. In the future, EYANG will continue to work close with clients, keep developing thinner and high-quality MLCC products to meet market needs.

For more detailed information about this specification, please visit the EYANG Technology website at http://www.szeyang.com to download the relevant specification sheets or contact EYANG Technology FAE for further information.