In recent years, the emergence of AI and other new applications has driven a pressing demand for enhanced chip functionalities. In the "post-Moore era," the raw materials and processes for components have almost reached their limits. The traditional packaging methods can no longer meet the placement requirements of components. Consequently, in order to find more design space, some chips and components are shifted towards being embedded within PCB boards. This packaging technique is known in the industry as “advanced packaging technology”. According to Yole, the advanced packaging market is growing fast and is expected to reach a revenue scale of $65 billion by 2027.

ECP (Embedded Chip Package) is one of advanced packaging technologies that involve embedding chips or components within a substrate. ECP promotes the miniaturization and slimming of products across many industries. Products using ECP technology can reduce their size without compromising overall performance, while also improving component heat dissipation and external protection. This paper focuses on the application of MLCC in ECP packaging.

In the power management modules using ECP packaging, copper terminal MLCCs are widely used. Embedding the MLCC within the PCB board, utilizing laser drilling, and copper plating connections enable vertical power supply, significantly reducing circuit wiring, lowering circuit loss, and enhancing power conversion efficiency.

Compared to tin-plated MLCC products, the main features of copper terminal MLCCs are:

1.     Special Termination Process:

The base copper layer allows wider and larger terminal areas, that will increase the contact space after embedding within the PCB.

2.     Plating Process:

Copper plating is directly applied to the base copper layer, that enhances the consistency and density of the copper terminals, along with anti-oxidation treatment.

3.     Testing and Inspection:

Strict control of exposure time during testing and inspection will avoid oxidation and quality degradation of copper terminal products.

4.     Storage:

Storage in a nitrogen environment will reduce the risk of terminal oxidation.

5.     Packaging:

The package uses aluminum foil bags, vacuum packaging, nitrogen filling, and includes a desiccant and moisture-sensitive card (with MSL=3 for copper terminal MLCC).

6.     Anti-Oxidation Testing:

This procedure ensures the quality through rigorous anti-oxidation testing of copper terminals.

Current Business Applications:

In the mature applications of power management chips, the mainstream sizes of MLCC are generally from 0201 to 0402. Due to height requirements for embedding within the PCB, 0402 typically comes in thinner specifications with a maximum thickness of 0.33mm, matching the height of 0201. The current capacitance range in use is generally from a few hundred pF to a few hundred nF. However, in the future market of high-performance chips, designers may require higher capacitance and more diverse packaging for copper terminal MLCCs, which can let chips get higher supply currents, such as 10μF or 22μF. The higher capacitance will also require larger sizes, which in turn results higher PCB layer heights, posing greater challenges for ECP packaging processes. EYANG actively collaborates with clients to overcome these technical challenges.

EYANG MLCC Products:

The copper terminal series is a mass-produced product line at EYANG Technology, and it will continue to meet market demands as outlined in EYANG's future roadmap. Designers are welcome to propose more specifications for copper terminal MLCCs for application in ECP packaging to EYANG Technology.

For more detailed information about this specification, please visit the EYANG Technology website at http://www.szeyang.com to download the relevant specification sheets or contact EYANG Technology FAE for further information.